The world’s leading semiconductor fabs, foundries, and OEMs trust Precision Polymer Engineering to provide reliable and effective semiconductor O-rings and seals for their critical applications.
Semiconductor processing environments present significant challenges for elastomer seals. PPE’s high-performance materials meet these application challenges, which often involve extreme heat, aggressive plasma, hot wet chemicals, amines, and remote NF3 cleaning.
PPE is always innovating high-performance elastomers which take steps forward in purity, chemical resistance, plasma resistance and high temperature capability. All PPE’s sealing materials and products are extensively tested in our in-house elastomer laboratories.
An extensive material portfolio including Perlast®, Perlast® Helios, Nanofluor®, and Kimura® offers unique O-ring solutions, which can reduce particle generation, extend seal life, and minimise replacement time during preventive maintenance.
A semiconductor process, combined with the set of environmental variables relevant to that process, will determine which type of elastomer is most suitable for your specific application.
Precision Polymer Engineering manufactures fully molded elastomer O-rings from 1.5mm (0.06″) to 2.5 metres (8ft) outer diameter, and 0.8mm (0.03″) to 12mm (0.47″) cross section.
PPE has a comprehensive range of molds for standard O-ring sizes BS1806, BS4518, AS568 and ISO3601.
For non-standard O-ring seals we can produce custom tooling very quickly (92% of O-ring tools are produced same day) providing cost effective solutions and a more responsive service. Our manufacturing lead-times are some of the shortest in the sealing industry.
Custom O-ring design can help to achieve the optimum performance from your semiconductor manufacturing equipment.
Precision Polymer Engineers offer a Component Design Service and modelling service for semiconductor custom O-rings, to ensure a seal which is engineered to handle the specific demands of your own application.
O-ring seal design can be optimised using Finite Element Analysis (FEA) to minimise high concentrations of localized stresses.
Finite Element Analysis (FEA) is a computer-based technique used to analyse semiconductor engineering applications and sealing components, to help understand their behaviour under a variety of conditions.
O-rings for semiconductor applications can be produced in the following material types, for a sealing solution which performs reliably against a range of thermal, chemical, and mechanical challenges.
The ultimate perfluoroelastomers for sealing applications where chemical resistance and high temperature performance are critical.
A unique range of fully organic elastomers, ideally suited to thermal, dynamic and specific plasma processes.
Hybrid materials bridging the gap between FKM and FFKM in plasma ash or resist strip, chlorine, and CxFy based etch processes.
PPE has a wealth of resources to help you select the right material and profile for your semiconductor application. Here is a selection of some of our most popular resources.
To browse the full range, visit Resources.
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