Thermal Processes

Abstract render of blue flame for thermal semicon applications

Thermal based applications need sealing materials with good mechanical properties, such as low compression set or compression stress relaxation, in addition to very specific chemical resistance requirements.

These processes often include the use of oxygen, ozone, or a combination of ozone and high energy UV radiation – such as applied to transistor strain engineering, FCVD, and low k processing.

Introducing Perlast® Helios – plasma resistant sealing in high temperatures
EXPERT GUIDE: ‘Causes of seal failure – Plasma Degradation’

We manufacture bespoke components for:

Metal CVD
ALD
LPCVD

SACVD

Oxidation Diffusions

UV Cure

RTP and
Thermal Oxidation

Semiconductor-orings-background

Benefits of PPE recommended products:

Processes such as ALD, LPCVD, SACVD, annealing and oxidation require seal materials able to withstand long term high temperatures.

Making the appropriate choice of PPE material for thermal processes will result in:

  • Cost optimized recommendation dependent on application
  • Low compression set
  • Longer lifetime in aggressive UV cure regimes
  • Low erosion rates
  • Low trace metal levels where critical
  • Low particle release rates where critical
  • Minimized impact on device yield and electrical yield
  • Reduced cost of consumables (CoC)

Recommended materials for thermal processes

The table below indicates recommended and compatible elastomer material grades. Primary grades are geared towards critical system/tool locations.

For further guidance on appropriate sealing choices in thermal process environments, get in touch with our experts for application-specific advice.

Picture of some silicone chips
Process/applicationTemperature rangeProcess mediaPrimary materialsCompatible materials
Metal CVD ALD LPCVD25 – 300°C
(77 – 572°F)		Organic precursors, WF6, TiCl4, SiH4, SiHCl3, SiH2Cl2, SiCl4, Ar, N2, H2, NH3, HF, HCl, F2, Cl2, CIF3, NF3, H2O vapour, O2, O3G7HAG75H, G70H, G75B
SACVD25 – 300°C
(77 – 572°F)		TEP, TEBO, TEOS, O3, O2, N2, NF3G7HA, G65HPG70H, G75B, G75H
Oxidation Diffusion100 – 300°C
(212 – 572°F)		N2, O2, H2O, POCl3, BBr3, PH3, B2H6, HCl, Cl2G7HA, G75HG65HP, G70H, G75B
RTP andThermal Oxidation100 – 300°C
(212 – 572°F)		IR radiation, O2, SteamG65HP, G75BG7HA, G75H, G70H
UV Cure100 – 300°C
(212 – 572°F)		N2, Ar, O2, O3G75H, G70HG76W

Need more help? Speak to one of our experts today.

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