Thermal Processes
Thermal based applications need sealing materials that have good mechanical properties, such as low compression set or compression stress relaxation, in addition to very specific chemical resistance requirements. Processes such as ALD, LPCVD, SACVD, annealing and oxidation require seal materials able to withstand long term high temperatures. These processes often include the use of oxygen, ozone or a combination of ozone and high energy UV radiation such as applied to transistor strain engineering, FCVD and low k processing.
Appropriate choice of PPE recommended products will lead to:
- Cost optimized recommendation dependent on application
- Low compression set
- Longer lifetime in aggressive UV cure regimes
- Low erosion rates
- Low trace metal levels where critical
- Low particle release rates where critical
- Minimized impact on device yield and electrical yield
- Reduced cost of consumables (CoC)
The table below indicates PPE's recommended and compatible elastomer material grades. Primary grades are geared towards critical system / tool locations. For further guidance on appropriate seal choices please find your nearest sales contact. You can also see our Perlast® materials for semiconductor applications here.
| Process/Application | Temperature range | Process media | Primary materials | Compatible materials |
| Metal CVD ALD LPCVD | 25 - 300°C (77 - 572°F) | Organic precursors, WF6, TiCl4, SiH4, SiHCl3, SiH2Cl2, SiCl4, Ar, N2, H2, NH3, HF, HCl, F2, Cl2, CIF3, NF3, H2O vapour, O2, O3 | G7HA | G75H, G70H, G75B |
| SACVD | 25 - 300°C (77 - 572°F) | TEP, TEBO, TEOS, O3, O2, N2, NF3 | G7HA, G65HP | G70H, G75B, G75H |
| Oxidation Diffusion | 100 - 300°C (212 - 572°F) | N2, O2, H2O, POCl3, BBr3, PH3, B2H6, HCl, Cl2 | G7HA, G75H | G65HP, G70H, G75B |
| RTP and Thermal Oxidation | 100 - 300°C (212 - 572°F) | IR radiation, O2, Steam | G65HP, G75B | G7HA, G75H, G70H |
| UV Cure | 100 - 300°C (212 - 572°F) | N2, Ar, O2, O3 | G75H, G70H | G76W |