Perlast® Helios GAM6

Developed exclusively for Applied Materials for use in etch and deposition process applications, Perlast^® Helios GAM6 has been designed for low erosion and ultra-low particle generation in high radical concentration plasma environments.

Perlast^® Helios GAM6 is a fully organic, high purity material, offering excellent fluorine plasma resistance.

It combines a fully fluorinated polymer backbone with a novel cross-linking system to provide a perfluoroelastomer material with an exceptional sealing performance at temperatures up to 310°C.

The fully organic structure of the material helps to eliminate particles and reduce the cost of ownership.

DOWNLOAD: Perlast^® Helios GAM6 Datasheet

Your Key Account Manager

If you would like to find out more about Perlast Helios GAM6, please get in touch with your Key Account Manager, Fiona Aguiar at:
Tel: +1 408 441 2043
Mobile: +1 408 565 5610
Email: [email protected]

Key features of Perlast® Helios GAM6

Here are some of the key features of Perlast® Helios GAM6, and how Applied Materials can benefit from this exclusively developed material.

Fluorine plasma resistance

Chemical resistance

High temperature performance

Low out-gassing

Very low trace metal particle generation

Plasma processes are amongst the most aggressive for elastomer seals, particularly those in critical locations that are exposed to the chemistry and in proximity to the wafer or substrate.

The most aggressive plasma processes for seals include oxygen resist strip and radical based plasmas such as remote NF₃ etching and chamber cleans using remote plasma sources (RPS).

GAM6 – exclusively available to Applied Materials – is a material which performs exceptionally well in plasma chemistries, and particularly in fluorine plasma.

ANIMATION: Avoiding plasma degradation chevron_right

In addition to high resistance to specific chemicals, it is imperative that seal materials do not contribute organic or trace metallic contamination to the cleaning or stripping fluids.

GAM6 is ideally suited to critical system and tool locations subject to wet chemical processes, resisting chemical erosion and resulting in low trace metal contamination and low particle release rates.

WATCH: Perlast FFKM and Chemical Resistance chevron_right

Thermal based applications need sealing materials that have good mechanical properties, such as low compression set or compression stress relaxation, in addition to very specific chemical resistance requirements.

Processes such as ALD, LPCVD, SACVD, annealing and oxidation require seal materials able to withstand long term high temperatures.

These processes often include the use of oxygen, ozone or a combination of ozone and high energy UV radiation such as applied to transistor strain engineering, FCVD and low k processing.

GAM6 meets all these requirements, and is available exclusively to Applied Materials.

WEBINAR: High temperature sealing in semicon applications chevron_right

Out-gassing is a failure mode of seals where constituent ingredients within the elastomer formulation are released (volatilized) under vacuum conditions.

These constituents can be either a part of the elastomer formulation, the decomposition products of the ingredients or other gasses which are trapped in the polymer matrix during the molding process. In semiconductor applications, out-gassed molecules can cause contamination during wafer processing.

GAM6 is rated to the correct temperature for the application, which helps to keep outgassing to a minimum.

ANIMATION: About outgassing, and how to avoid it chevron_right

Particles and metallic ion contamination are a constant threat to the manufacture of semiconductor devices. The smaller the device, the greater the potential for harm and increased cost as the level of permissible contamination reduces.

When choosing elastomer seals for critical applications, device manufacturers must ensure that they select appropriate materials with ultra-low levels of trace metals. GAM6, which has been developed specifically for Applied Materials, can help to avoid contamination and device degradation.

Reducing trace metal contaminants chevron_right

Fluorine plasma resistance expand_more

Plasma processes are amongst the most aggressive for elastomer seals, particularly those in critical locations that are exposed to the chemistry and in proximity to the wafer or substrate.

The most aggressive plasma processes for seals include oxygen resist strip and radical based plasmas such as remote NF₃ etching and chamber cleans using remote plasma sources (RPS).

GAM6 – exclusively available to Applied Materials – is a material which performs exceptionally well in plasma chemistries, and particularly in fluorine plasma.

Chemical resistance expand_more

In addition to high resistance to specific chemicals, it is imperative that seal materials do not contribute organic or trace metallic contamination to the cleaning or stripping fluids.

High temperature performance expand_more

Processes such as ALD, LPCVD, SACVD, annealing and oxidation require seal materials able to withstand long term high temperatures.

These processes often include the use of oxygen, ozone or a combination of ozone and high energy UV radiation such as applied to transistor strain engineering, FCVD and low k processing.

GAM6 meets all these requirements, and is available exclusively to Applied Materials.

Low out-gassing expand_more

Out-gassing is a failure mode of seals where constituent ingredients within the elastomer formulation are released (volatilized) under vacuum conditions.

GAM6 is rated to the correct temperature for the application, which helps to keep outgassing to a minimum.

Very low trace metal particle generation expand_more

Enquiry Form

Please complete the form below and one of our experts will contact you.

Your Name*

First Last

Email*

Contact Number

Company*

Industry

Country

Industry Other

Please specify

Your Enquiry

By submitting this form you agree to our privacy policy and what we do with your information.

This site is protected by reCAPTCHA and the Google Privacy Policy and Google Terms of Service apply.

Contact

+44 (0)1254 295400

+1 979 353 7350

Follow Us