Semiconductor manufacturing is relatively high risk. It can be highly sensitive and susceptible to minute deviations in any one of a multitude of process steps. These deviations need not be directly related to the process conditions. There are potentially risks from process chamber component degradation which is generally difficult or impossible to monitor in situ.
The elastomer or O-ring seal is one of the components than can significantly impact yield and cost of manufacture. Particularly where plasma and UV processing is concerned, lifetime is a key factor but, degradation by-products can impact cost through contamination of product. This can have immediate catastrophic impact or, lead to latent failures that only become apparent when the component is built into an electronic system.
Testing or qualifying new materials, for both fabs and original equipment manufacturers, is generally a lengthy and risky proposition. The topics covered will provide practical guidance on elastomer material compatibility in aggressive high energy processes such as UV film modification and curing.
Key take-aways:
- UV applications in semiconductor processing
- How does UV attack an elastomer
- Elastomer composition and chemical compatibility
- Materials of choice in UV processing