LAM Research Approved Materials from PPE

The table below shows the material grades that are currently approved for use by LAM Research.
Material datasheets can be downloaded by clicking on the PDF link in the last column.

CompoundMaterial
Type
ColorOperating
Temperature
Process TypeAttributesDatasheet
Perlast® G67PFFKMTranslucent-15 to 275°CPECVD/HDPVD
Wet Etch/Clean
Photolithography
Resist Strip
  • Fully organic
  • Exceptional purity (>1K ppb trace metal content)
  • Low particle generation
  • Extremely low out-gassing
PDF
Perlast® G74PFFKMTranslucent-15 to 275°C
  • Fully organic
  • Exceptional purity
PDF
Perlast® G100XTFFKMClear
Translucent
-20 to 275°CE-UV
  • Fully organic
  • Ultra-low out-gassing
PDF
Perlast® G65HPFFKMLight Brown-15 to 275°CPECVD/HDPCVD
Resist-Strip/Ash
Dielectric Etch
Condictor Etch
NF3 Remote Clean
  • Fully organic
  • Exceptional resistance to radical flourine
  • Excellent plasma resistance
  • Very low particle generation
PDF
Perlast® G67GFFKMGrey-15 to 300°CPECVD/HDPCVD
Resist Strip/Ash
Dielectric Etch
Conductor Etch
NF3 Remote clean
UV cure
  • Exceptional oxygen & flourine plasma resistance
  • Low particle generation
 PDF
Perlast® G76WFFKMIvory-15 to 260°C
  • Cost effective, high performance perfluoroelastomer
 PDF
Perlast® G75HFFKMWhite-15 to 320°CMetal CVD
ALD
PVD
LPCVD
SACVD
Oxidation diffusion
RTP/Thermal Oxidation
  • High temperature stability
  • Wide chemical resistance
  • Outstanding physical properties
  • Ideal for dynamic applications
 PDF
Perlast® G70HFFKMWhite-15 to 310°CPVD
  • Very good plasma resistance
  • Very good abrasion resistance
PDF 
Perlast® G80AFFKMBlack-15 to 260°CWet Etch/Clean
Photolithography/Resist Strip
  • General purpose perfluoroelastomer
 PDF
Perlast® G75BFFKMBlack-15 to 325°CMetal CVD
ALD
PVD
LPCVD
SACVD
Oxidation diffusion
RTP/Thermal oxidation
  • Excellent high temperature stability
  • Exceptional acid & amine resistance
PDF
Nanofluor® Y75NHPEAmber/
Translucent
-20 to 225°CPhotolithography/Resist strip
E-UV
  • Exceptional purity (>10K ppb trace metal content)
  • Very low permeability
  • Very low out-gassing
PDF
Nanofluor® Y75GHPEGrey-20 to 260°CResist Strip/Ash
Dielectric Etch
Conductor Etch
  • Exceptional oxygen & chlorine plasma resistance
  • Very low trace metal content
  • Low particle generation
PDF
Kimura® K2CD HPE Red-15 to 300°CMetal CVD
ALD
PVD
LPCVD
SACVD
Oxidation diffusion
  • Fully organic
  • Good resistance to fluorine radicals
PDF
Kimura® K13XHPE Brown/
Amber 
-15 to 280°C Dielectric etch
  • Fully organic
  • Excellent abrasion resistance
  • Ideal for dynamic applications
  • Very low permeability
PDF
Kimura® K23XHPE Red -15 to 270°C 
  • Fully organic
  • Good plasma resistance
PDF
Kimura® K13XSHPE Brown/
Amber 
-15 to 280°C Dielectric etch
  • Fully organic
  • Good mechanical properties
PDF
V75SC FKM Cream-15 to 250°C Copper plating (ECD)
  • Very low permeability
  • Cost effective high performance elastomer
PDF
V75P FKM Black-18 to 260°C 
  • Very low compression set
  • Excellent long-term high temp stability
  • Excellent heat-ageing properties
PDF

 

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