email address
password
Forgotten my password

Material Grades for Semiconductor Applications

by Semiconductor process

Category Process Type Environments Suggested Compounds

 
Etch

Metal etching
Dielectric etching
Silicon etching

CF4, C3F8, CHF3, SF6, O2, H2, HBR, BCI3, CCI4, CI2

K13X, K23X, K2CD, 
G100XT

 

Delectric Deposition

HDP CVD
PECVD
SACVD
BPSG
HARP™

TEOS, SiH4, NH3, O2, O3, NF3, CF4, C2F6, SiF4

K2CD, G67P, G74P,
G100XT, G75H

 

Metallization

PVD

WCVD
ALD
PDL

Ar, N2, WF6, SiH4, TiCI2, H2, NF3, 03, H20, AL2O3, HfO2, HfSiOx, SiO2, TiO2, Ta2O5, AHO, ATO, SiN

K13X, K23X

G100XT, G67P, G74P,
V75SC

Chemical Mechanical Planarization CMP   V75SC
Electrofill/Electro Copper Plating ECP CuSO4, H2SO4 V75SC
Wet Clean     V75SC
Wet Etch/Stripping     G75H, G100XT, K2CD
Wafer Handling All   G67P, K13X, K23X
Ashing   CF4, CHF3, SF6, O2, H2O G67P, G74P, G75H, K13X, K23X, K2CD

 

IDEX - Sealing Solutions
© Copyright Precision Polymer Engineering Ltd.
Registered Office: Greenbank Road, Blackburn, BB1 3EA, England. Registration No. 1476647
Connect with Prepol at LinkedIn Follow Prepol on Twitter